Did you know that processors, and other packaged integrated circuits, often contain more than one die (aka chip)? It’s not something you can tell by looking at them.

They look the same, but the insides are changing. Names such as “multi-chip modules” (MCM), “system in package” (SIP), “3D stacking,” and “flip chips” have been used to describe this trend of packing multiple dies in a package.
It’s becoming common now. Moshen, Pentiumpro moshen, CC BY-SA 2.5
What’s inside that package?To read this article in full, please click here

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